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		<title>The Thermal Paradox: Why Hardware Reliability is the Strategic Frontier for Edge AI</title>
		<link>https://www.teqdiligent.com/thermal-paradox-for-edge-ai-hardware/?utm_source=rss&#038;utm_medium=rss&#038;utm_campaign=thermal-paradox-for-edge-ai-hardware</link>
		
		<dc:creator><![CDATA[Siddharth]]></dc:creator>
		<pubDate>Tue, 20 Jan 2026 18:35:14 +0000</pubDate>
				<category><![CDATA[Technical]]></category>
		<guid isPermaLink="false">https://www.teqdiligent.com/?p=10120</guid>

					<description><![CDATA[<p>While the industry has focused on model "intelligence," the shift to Edge AI has revealed that the laws of physics—specifically thermal management—are the true barrier to production-grade scaling. Unmanaged heat does more than throttle performance; it acts as a "silent killer" of hardware, driving up Total Cost of Ownership (TCO) through silicon degradation and field failures. To build a sustainable competitive moat, organizations must transition from a software-centric mindset to one that prioritizes "The New Cooling Stack" and hardware-software co-design. Ultimately, in the maturing Edge AI market, high-performance benchmarks may initiate a partnership, but hardware reliability is what secures the contract and ensures long-term ROI....</p>
<p>The post <a rel="nofollow" href="https://www.teqdiligent.com/thermal-paradox-for-edge-ai-hardware/">The Thermal Paradox: Why Hardware Reliability is the Strategic Frontier for Edge AI</a> appeared first on <a rel="nofollow" href="https://www.teqdiligent.com">Teq Diligent</a>.</p>
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			<p style="text-align: justify; font-family: verdana;">In the high-stakes race to dominate the artificial intelligence landscape, the industry has largely fixated on a single metric: the &#8220;intelligence&#8221; of the model. We celebrate parameter counts, benchmark accuracy and the nuances of transformer architectures. However, as we shift these models from the pristine, climate-controlled environments of hyperscale data centers to the unpredictable &#8220;Edge,&#8221; a much harsher reality sets in.</p>
<p>&nbsp;</p>
<p style="text-align: justify; font-family: verdana;">At the edge—whether it is a smart sensor on a factory floor, a computer vision unit in an autonomous vehicle or a gateway in a remote telecommunications tower—the laws of physics are non-negotiable. Here, the primary barrier to success isn’t the complexity of the neural network; it is the reliability of the hardware under thermal duress.</p>
<p>&nbsp;</p>
<p style="text-align: justify; font-family: verdana;">As a technologist, we have seen countless Edge AI projects stall not because the algorithms were flawed but because the hardware could not sustain the performance required. To build for the future, we must move past the software-centric mindset and recognize that reliability is the ultimate competitive moat.</p>
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			<p style="text-align: left; font-family: Georgia; font-size: 30px; color: #e5751f; line-height: 1.3;"><strong> MINIATURE CMOS CAMERA</strong></p>
<p>&nbsp;</p>
<p style="text-align: justify; font-family: Georgia; font-size: 20px;">[Case Study]</p>
<p>&nbsp;</p>
<p style="text-align: justify; font-family: Georgia; font-size: 15px;">This 5MP CMOS camera is developed to provide a CMOS sensor based ARM platform to port specialized scientific image processing algorithms.</p>

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			<h3 style="text-align: left;"><strong>1. The Physics of Performance: When Heat Becomes a Bottleneck </strong></h3>
<p>&nbsp;</p>
<p style="text-align: justify; font-family: verdana;">The fundamental challenge of Edge AI is the density of computation. Running deep learning models—especially generative AI or high-frame-rate computer vision—requires massive parallel processing. This generates significant heat. In a data center, this heat is managed by industrial-grade HVAC systems. At the edge, we often work with compact, fanless enclosures where airflow is a luxury we cannot afford.</p>
<p>&nbsp;</p>
<p style="text-align: justify; font-family: verdana;">When heat accumulates, the system enters a state of thermal throttling. This is a self-preservation mechanism where the silicon (GPU or NPU) automatically reduces its clock speed to prevent catastrophic failure.</p>
<p>&nbsp;</p>
<p style="text-align: justify; font-family: verdana;">For an Edge AI application, thermal throttling is a performance killer. A model that runs at 60 frames per second at &#8220;cold start&#8221; might drop to 15 frames per second after twenty minutes of sustained load. In a mission-critical application—such as a robotic arm in a production line or an obstacle detection system in a drone—this lack of reliability is not just an inconvenience; it is a point of failure.</p>
<p>&nbsp;</p>
<h3 style="text-align: left;"><strong>2. The &#8220;Silent Killer&#8221;: Thermal Stress and Silicon Degradation</strong></h3>
<p>&nbsp;</p>
<p style="text-align: justify; font-family: verdana;">The most dangerous aspect of poor thermal management isn&#8217;t a sudden crash; it is the silent, long-term degradation of the hardware. In my experience, many production systems pass initial stress tests only to see their reliability plummet after six to twelve months in the field.</p>
<p>&nbsp;</p>
<p style="text-align: justify; font-family: verdana;">This is often caused by Electromigration and Thermal Cycling. High temperatures accelerate the movement of atoms in the metallic interconnects within a chip, eventually leading to circuit failure. Furthermore, the constant expansion and contraction of components as they heat up and cool down (thermal cycling) creates mechanical stress on solder joints and PCB layers.</p>
<p>&nbsp;</p>
<p style="text-align: justify; font-family: verdana;">Over time, this thermal stress changes how the silicon behaves. You might experience increased error rates in memory access or subtle &#8220;bit flips&#8221; during computation. For a company, this means increased maintenance costs, higher RMA (Return Merchandise Authorization) rates and most importantly, a loss of customer trust. Reliability cannot be an afterthought; it must be baked into the silicon and the system architecture from day one.</p>
<p>&nbsp;</p>
<h3 style="text-align: left;"><strong>3. Engineering Resilience: The New Cooling Stack</strong></h3>
<p>&nbsp;</p>
<p style="text-align: justify; font-family: verdana;">To ensure hardware reliability, we are seeing a shift away from traditional conduction and toward more aggressive, &#8220;data-center-inspired&#8221; cooling technologies at the edge.</p>
<p>&nbsp;</p>
<p style="text-align: justify; font-family: verdana;">• Vapor Chambers and Heat Pipes: Traditional aluminum heatsinks are often insufficient for the high TDP (Thermal Design Power) of new era AI accelerators. Vapor chambers utilize phase-change principles to spread heat uniformly across a surface, preventing the &#8220;hotspots&#8221; that lead to localized silicon aging.</p>
<p>&nbsp;</p>
<p style="text-align: justify; font-family: verdana;">• Phase Change Materials (PCMs): For edge devices that experience &#8220;bursty&#8221; workloads—where AI inference happens in intense intervals—PCMs act as a thermal buffer. They absorb excess energy by changing state (from solid to liquid), protecting the hardware from sharp temperature spikes.</p>
<p>&nbsp;</p>
<h3 style="text-align: left;"><strong>4. Hardware-Software Co-Design: The Strategic Unlock</strong></h3>
<p>&nbsp;</p>
<p style="text-align: justify; font-family: verdana;">The most sophisticated approach to reliability involves a &#8220;symphony&#8221; between the hardware and the software. We can no longer afford to treat them as separate silos.</p>
<p>&nbsp;</p>
<p style="text-align: justify; font-family: verdana;">Quantization and Pruning are often discussed as ways to make models faster, but their real value lies in thermal efficiency. By moving from FP32 (floating-point) to INT8 or even 1-bit models, we drastically reduce the number of transistors firing per inference. Less switching activity means less heat. A &#8220;cool&#8221; model is, by definition, a more reliable model.</p>
<p>&nbsp;</p>
<p style="text-align: justify; font-family: verdana;">Furthermore, we are now implementing Dynamic Thermal Intelligence. Rather than waiting for a chip to hit a critical temperature and throttle, modern Edge AI orchestrators monitor thermal sensors in real-time. They can preemptively migrate tasks to a secondary core or adjust the duty cycle of the NPU to maintain a steady temperature. This proactive approach ensures that the system provides consistent, predictable performance—the very definition of reliability.</p>
<p>&nbsp;</p>
<h3 style="text-align: left;"><strong>5. Reliability as a Market Differentiator</strong></h3>
<p>&nbsp;</p>
<p style="text-align: justify; font-family: verdana;">Now as the market for Edge AI is maturing, Customers are moving away from the &#8220;novelty&#8221; of AI and toward &#8220;production-grade&#8221; requirements. Procurement teams are no longer just looking at TOPS per dollar; they are looking at TCO (Total Cost of Ownership) over a five-year lifecycle.</p>
<p>&nbsp;</p>
<p style="text-align: justify; font-family: verdana;">A device that is 20% faster but has a 10% annual failure rate due to thermal stress is a liability. Conversely, a device that guarantees sustained performance in ambient temperatures ranging from -40°C to +85°C is a strategic asset.</p>
<p>&nbsp;</p>
<p style="text-align: justify; font-family: verdana;">As technology leaders, we must communicate to our stakeholders that reliability is not a &#8220;boring&#8221; engineering spec. It is the foundation upon which the entire AI economy is built. If the hardware isn&#8217;t reliable, the AI isn&#8217;t useful.</p>
<p>&nbsp;</p>
<h3 style="text-align: left;"><strong>The Path Forward: Trust Over Benchmarks</strong></h3>
<p>&nbsp;</p>
<p style="text-align: justify; font-family: verdana;">As we look toward the next decade of embedded innovation, the focus will continue to shift. We have already proven that we can make models smart. Now, we must prove that we can make them endure.</p>
<p>&nbsp;</p>
<p style="text-align: justify; font-family: verdana;">The future of Edge AI belongs to the companies that respect the physics of the edge. By investing in advanced thermal management, embracing hardware-software co-optimization and prioritizing reliability as a core KPI, we can build systems that don&#8217;t just work in the lab but thrive in the real world.</p>
<p>&nbsp;</p>
<p style="text-align: justify; font-family: verdana;">At the end of the day, fast models might get you the meeting but cool, reliable hardware will get you the contract.</p>

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<p>The post <a rel="nofollow" href="https://www.teqdiligent.com/thermal-paradox-for-edge-ai-hardware/">The Thermal Paradox: Why Hardware Reliability is the Strategic Frontier for Edge AI</a> appeared first on <a rel="nofollow" href="https://www.teqdiligent.com">Teq Diligent</a>.</p>
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		<title>5 Practical Ways to Reduce BOM Costs : Ideas for engineering and business leaders to profitable products</title>
		<link>https://www.teqdiligent.com/5-practical-ways-to-reduce-bom-costs-ideas-for-engineering-and-business-leaders-to-profitable-products/?utm_source=rss&#038;utm_medium=rss&#038;utm_campaign=5-practical-ways-to-reduce-bom-costs-ideas-for-engineering-and-business-leaders-to-profitable-products</link>
		
		<dc:creator><![CDATA[Siddharth]]></dc:creator>
		<pubDate>Mon, 20 Mar 2023 18:52:41 +0000</pubDate>
				<category><![CDATA[Technical]]></category>
		<guid isPermaLink="false">https://www.teqdiligent.com/?p=9109</guid>

					<description><![CDATA[<p>Reducing the BOM (Bill of Materials) cost of electronic hardware products involves two key components: procurement optimization and design optimization. While procurement optimization focuses on finding the best suppliers and negotiating prices, design optimization involves making strategic choices during the product development phase. In this post, we'll be delving into the world of design optimization and exploring the various strategies you can use to cut BOM costs without sacrificing quality or performance......</p>
<p>The post <a rel="nofollow" href="https://www.teqdiligent.com/5-practical-ways-to-reduce-bom-costs-ideas-for-engineering-and-business-leaders-to-profitable-products/">5 Practical Ways to Reduce BOM Costs : Ideas for engineering and business leaders to profitable products</a> appeared first on <a rel="nofollow" href="https://www.teqdiligent.com">Teq Diligent</a>.</p>
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			<p style="text-align: justify; font-family: verdana;">Reducing the BOM (Bill of Materials) cost of electronic hardware products involves two key components: procurement optimization and design optimization. While procurement optimization focuses on finding the best suppliers and negotiating prices, design optimization involves making strategic choices during the product development phase. In this post, we&#8217;ll be delving into the world of design optimization and exploring the various strategies you can use to cut BOM costs without sacrificing quality or performance.</p>
<p>&nbsp;</p>
<h3 style="text-align: left;"><strong>( 1 ) BOM cost audit</strong></h3>
<p>&nbsp;</p>
<p style="text-align: justify; font-family: verdana;">A BOM cost audit is a critical step in reducing the cost of electronic hardware products. It involves analyzing the bill of materials (BOM) for the product and identifying opportunities for cost savings. By conducting a BOM cost audit, you can gain insights into which components contribute the most to the overall cost, and determine whether there are cheaper alternatives available.</p>
<p>&nbsp;</p>
<p style="text-align: justify; font-family: verdana;">Moreover the 80/20 rule is more or less applicable to BOM cost audit. It means a low percentage of the components contribute to 80% of the cost, you can target these components for optimization. Often, ICs, connectors, protection components, crystals, and PCBs make up the bulk of the BOM cost.</p>

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			<p style="text-align: left; font-family: Georgia; font-size: 30px; color: #e5751f; line-height: 1.3;"><strong> MINIATURE CMOS CAMERA</strong></p>
<p>&nbsp;</p>
<p style="text-align: justify; font-family: Georgia; font-size: 20px;">[Case Study]</p>
<p>&nbsp;</p>
<p style="text-align: justify; font-family: Georgia; font-size: 15px;">This 5MP CMOS camera is developed to provide a CMOS sensor based ARM platform to port specialized scientific image processing algorithms.</p>

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			<p style="text-align: justify; font-family: verdana;">Through the BOM cost audit, you can explore different component options and analyze the potential impact on the product&#8217;s performance and quality. This can lead to significant cost savings while ensuring that the product meets the required standards and specifications.</p>
<p>&nbsp;</p>
<p style="text-align: justify; font-family: verdana;">In conclusion, conducting a BOM cost audit is a valuable exercise for any company looking to reduce costs and optimize their product&#8217;s performance. It is an essential step in the product development process, and can help to identify areas where changes can be made without compromising quality or performance.</p>
<p>&nbsp;</p>
<h3 style="text-align: left;"><strong>( 2 ) Exploring different architectures</strong></h3>
<p>&nbsp;</p>
<p style="text-align: justify; font-family: verdana;">Exploring different architectures is an essential step in optimizing the Bill of Materials (BOM) cost for a product. Different architectures can offer various advantages and disadvantages in terms of cost, functionality, and performance. By exploring different architectures, designers can identify the most cost-effective solutions that meet the product&#8217;s requirements.</p>
<p>&nbsp;</p>
<p style="text-align: justify; font-family: verdana;">For example, some architectures may require fewer components or less complex manufacturing processes, leading to lower BOM costs. Other architectures may offer more flexibility in component selection, allowing designers to choose lower-cost alternatives without sacrificing performance or quality.</p>
<p>&nbsp;</p>
<p style="text-align: justify; font-family: verdana;">Exploring different architectures can also lead to innovative solutions that can differentiate the product from its competitors, ultimately increasing its value proposition. While exploring different architectures can be time-consuming, the potential benefits in terms of cost savings and product differentiation make it an important step in optimizing the BOM cost.</p>
<p>&nbsp;</p>
<h3><strong>( 3 ) Features audit</strong></h3>
<p>&nbsp;</p>
<p style="text-align: justify; font-family: verdana;">Features audits are a crucial step in optimizing the Bill of Materials (BOM) cost for a product. One of the most effective ways to optimize BOM cost is to remove features that do not contribute to the end customer&#8217;s value add. By conducting a feature audit, designers can identify the product features that are not essential or do not provide significant value to the end customer.</p>
<p>&nbsp;</p>
<p style="text-align: justify; font-family: verdana;">Removing such features can lead to cost savings, as each feature adds cost to the BOM. Additionally, removing non-essential features can simplify the manufacturing process and reduce the risk of defects, ultimately improving product reliability and customer satisfaction.</p>
<p>&nbsp;</p>
<p style="text-align: justify; font-family: verdana;">However, it is crucial to conduct a thorough analysis to ensure that the removed features do not adversely affect the product&#8217;s performance or quality. Designers must carefully consider the impact of each feature on the product&#8217;s functionality, customer needs, and market positioning before making any changes.</p>
<p>&nbsp;</p>
<p style="text-align: justify; font-family: verdana;">In conclusion, a feature audit is a critical step in optimizing the BOM cost while ensuring that the product meets the customer&#8217;s needs and expectations. By removing non-essential features, designers can simplify the manufacturing process, reduce costs, and improve the product&#8217;s overall value proposition.</p>
<p> </p>

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			<h3><strong>( 4 ) Build common inventory across different products</strong></h3>
<p>&nbsp;</p>
<p style="text-align: justify; font-family: verdana;">As companies strive to optimize their product costs, building a common inventory across different products can be a game-changer. By using common components across different products, designers can benefit from economies of scale and reduce the number of unique parts, leading to significant cost savings.</p>
<p>&nbsp;</p>
<p style="text-align: justify; font-family: verdana;">One of the key benefits of a common inventory is the increased purchasing power it provides. By consolidating purchases, companies can negotiate better prices with suppliers and reduce logistics costs. This, in turn, can lead to lower BOM costs and higher profit margins.</p>
<p>&nbsp;</p>
<p style="text-align: justify; font-family: verdana;">Furthermore, building a common inventory can simplify the manufacturing process, reduce lead times, and improve overall product quality. By standardizing components, companies can streamline production and reduce the risk of errors, ultimately leading to greater customer satisfaction and brand loyalty.</p>
<p>&nbsp;</p>
<p style="text-align: justify; font-family: verdana;">In conclusion, building a common inventory is a cost-effective way to optimize the BOM (Bill of Materials) cost while realizing the benefits of economies of scale. By consolidating purchases, simplifying the manufacturing process, and reducing the risk of obsolescence, companies can improve their profitability and competitiveness.</p>

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			<h3><strong>( 5 ) Design for manufacturability (DFM)</strong></h3>
<p>&nbsp;</p>
<p style="text-align: justify; font-family: verdana;">Design for Manufacturability (DFM) is a critical aspect of BOM cost optimization. By designing products that are easy to manufacture, companies can reduce production costs, improve product quality, and realize the benefits of economies of scale.</p>
<p>&nbsp;</p>
<p style="text-align: justify; font-family: verdana;">One of the primary benefits of DFM is the reduction of manufacturing time and labor costs. By designing products that require fewer steps to assemble, companies can minimize the amount of time and labor required, resulting in faster production times and lower production costs. Additionally, DFM can help companies reduce waste and optimize their production processes, further reducing costs.</p>
<p>&nbsp;</p>
<p style="text-align: justify; font-family: verdana;">Another benefit of DFM is the improvement of product quality. By designing products that are easy to assemble, companies can reduce the risk of errors and defects, resulting in higher product quality and greater customer satisfaction. DFM can also help companies reduce the risk of product failures and recalls, protecting their brand reputation and reducing the cost of product redesign.</p>
<p>&nbsp;</p>
<p style="text-align: justify; font-family: verdana;">In conclusion, DFM is a critical aspect of BOM (Bill of Materials) cost optimization that offers numerous benefits, including reduced production costs, improved product quality, and the realization of economies of scale. By designing products with manufacturing in mind, companies can improve their profitability and competitiveness, while also delivering high-quality products that meet customer needs and expectations.</p>

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<p>The post <a rel="nofollow" href="https://www.teqdiligent.com/5-practical-ways-to-reduce-bom-costs-ideas-for-engineering-and-business-leaders-to-profitable-products/">5 Practical Ways to Reduce BOM Costs : Ideas for engineering and business leaders to profitable products</a> appeared first on <a rel="nofollow" href="https://www.teqdiligent.com">Teq Diligent</a>.</p>
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		<title>8 Mindset Traps: Overcoming them as a Technology Leaders save you from costly design iterations</title>
		<link>https://www.teqdiligent.com/8-mindset-traps-overcoming-them-as-a-technology-leaders-save-you-from-costly-design-iterations/?utm_source=rss&#038;utm_medium=rss&#038;utm_campaign=8-mindset-traps-overcoming-them-as-a-technology-leaders-save-you-from-costly-design-iterations</link>
		
		<dc:creator><![CDATA[Siddharth]]></dc:creator>
		<pubDate>Wed, 01 Mar 2023 18:01:49 +0000</pubDate>
				<category><![CDATA[Technical]]></category>
		<guid isPermaLink="false">https://www.teqdiligent.com/?p=9100</guid>

					<description><![CDATA[<p>While a first-time-right design may be the ultimate goal for any product development team, achieving it is often challenging and may not always be possible. However, there are certain mindsets that can prevent a first-time-right design from being achieved. By recognizing the importance of thorough design, clear communication.....</p>
<p>The post <a rel="nofollow" href="https://www.teqdiligent.com/8-mindset-traps-overcoming-them-as-a-technology-leaders-save-you-from-costly-design-iterations/">8 Mindset Traps: Overcoming them as a Technology Leaders save you from costly design iterations</a> appeared first on <a rel="nofollow" href="https://www.teqdiligent.com">Teq Diligent</a>.</p>
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			<p style="text-align: justify; font-family: verdana;">While a first-time-right design may be the ultimate goal for any product development team, achieving it is often challenging and may not always be possible. The complexity of the product being developed can make it necessary to make revisions to the design, even after careful planning and execution. However, there are certain mindsets that can prevent a first-time-right design from being achieved. By recognizing the importance of thorough design, clear communication, well-defined traceability and acknowledging the complexity of the design process; product development teams can increase their chances of success. Ultimately, while a first-time-right design may be elusive, striving for excellence and a continuous improvement mindset can lead to better outcomes and greater satisfaction for all involved in the design process. Here are some of the mindsets to stay away from to reduce costly design iterations:</p>
<p>&nbsp;</p>
<h3 style="text-align: left;"><strong>(1) Neglecting traceability of requirements throughout the validation process / Lack of traceability matrix</strong></h3>
<p>&nbsp;</p>
<p style="text-align: justify; font-family: verdana;">Tracking requirements throughout the development process up to validation, promotes clarity and alignment among stakeholders. By doing so, any gaps or missing elements in the design, development, testing or certification phases can be identified and addressed. This helps to minimize uncertainty, reduce risk and ultimately lead to a more successful outcome for the product development</p>

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			<p style="text-align: left; font-family: Georgia; font-size: 30px; color: #e5751f; line-height: 1.3;"><strong> MINIATURE CMOS CAMERA</strong></p>
<p>&nbsp;</p>
<p style="text-align: justify; font-family: Georgia; font-size: 20px;">[Case Study]</p>
<p>&nbsp;</p>
<p style="text-align: justify; font-family: Georgia; font-size: 15px;">This 5MP CMOS camera is developed to provide a CMOS sensor based ARM platform to port specialized scientific image processing algorithms.</p>

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			<h3 style="text-align: left;"><strong>(2) No design documentation / Considering Design documentation as burden to development process</strong></h3>
<p>&nbsp;</p>
<p style="text-align: justify; font-family: verdana;">Design documentation is at times seen as a burden to the process. But a clear and concise design document can help ensure that all stakeholders understand the project goals, requirements, and constraints. Documenting the product’s design can help identify potential risks and limitations of design. This can help address them before they become major issues. With a clear design document, it becomes easier to maintain and update the project over time, making it easier to adapt to changing requirements or market conditions. But time spent on design will give its fruits in smooth and hassle free validations and also saves from costly iterations.</p>
<p>&nbsp;</p>
<h3><strong>(3) Not paying attention to details</strong></h3>
<p>&nbsp;</p>
<p style="text-align: justify; font-family: verdana;">Attention to detail is critical for successful product design, as it ensures that all components of the product work together seamlessly and that the product functions as intended. However, designers may sometimes overlook minor details, assuming that they will work fine. Such assumptions can lead to issues with prototypes, which may require costly iterations to correct. Therefore, it is essential to scrutinize even the smallest details during the design process to avoid these issues. By paying attention to every aspect of the design, designers can ensure that their product meets the desired specifications and that it functions efficiently.</p>
<p>&nbsp;</p>
<h3><strong>(4) Ignoring reviews at multiple levels &amp; independence in the review process</strong></h3>
<p>&nbsp;</p>
<p style="text-align: justify; font-family: verdana;">Reviews play a crucial role in the design process because they help identify errors that can occur during manual design work. Conducting proper reviews at various stages of the design process can help catch and correct these errors early on, which can save valuable time and resources. To make reviews even more effective, they should be conducted by a team or individual who is not involved in the design activities. This helps eliminate any biases that the designer may have and ensures that the review is more objective and meaningful. Overall, incorporating reviews into the design process can lead to a more accurate and efficient design, while increasing the likelihood of first time right design</p>
<p>&nbsp;</p>
<h3><strong>(5) Cutting corners in validation process</strong></h3>
<p>&nbsp;</p>
<p style="text-align: justify; font-family: verdana;">Both design and testing are equally crucial phases of the design process, and ignoring either one can result in costly iterations. Neglecting to identify mistakes during the validation/testing phase can be especially costly for companies, as it may result in product recalls. To ensure the reliability of a product&#8217;s functionality in the field, it is essential to identify all the corner cases of its functionalities and conduct thorough validation for each of them. By doing so, any potential issues can be identified and addressed early on, which can help prevent costly recalls and improve customer satisfaction. Therefore, companies should focus on both the design and testing phases of the product development process to ensure that their products meet high-quality standards and deliver exceptional value to customers.</p>

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			<h3><strong>(6) Not starting pre-scans early on in the process</strong></h3>
<p>&nbsp;</p>
<p style="text-align: justify; font-family: verdana;">Pre-scans are EMI/EMC tests that are conducted before final certification. Based on industry observations, most designs fail during pre-scans when tested for the first time. Delaying pre-scans may increase the likelihood of failures in later stages of the design process. Therefore, it is recommended to conduct pre-scans early on in the design process whenever possible. This can help identify potential issues at an early stage, allowing designers to address them promptly and avoid costly rework later on. By prioritizing pre-scans, designers can ensure that their product meets the necessary standards for EMI/EMC, reducing the risk of failure and increasing the likelihood of a successful product launch.</p>
<p>&nbsp;</p>
<h3><strong>(7) Not engaging with the customer feedback early on in the process</strong></h3>
<p>&nbsp;</p>
<p style="text-align: justify; font-family: verdana;">While internal reviews are helpful for identifying design-level issues, customer or user feedback is equally essential for discovering user-level issues. As such, it is recommended that designers involve customers or users in document reviews and acceptance testing wherever possible during the design process.</p>

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			<p style="text-align: justify; font-family: verdana;">This way, designers can receive valuable feedback that can help improve the product design and better meet the needs of end-users. Incorporating feedback from customers or users can lead to more intuitive and user-friendly products that are more likely to be successful in the market. By prioritizing customer or user feedback throughout the design process, designers can ensure that their products meet the highest standards of usability and deliver exceptional value to end-users.</p>
<p>&nbsp;</p>
<h3><strong>(8) Designing in isolation</strong></h3>
<p>&nbsp;</p>
<p style="text-align: justify; font-family: verdana;">Designing in isolation is a sure shot way of failure in the design process. Effective communication is crucial for minimizing the number of design iterations. This communication must occur between designers and users, as well as between designers and cross-functional teams. By communicating openly and frequently, designers can raise concerns and correct any misunderstandings that may arise early on in the design process. This approach can help minimize the need for costly rework and ensure that the final product meets the needs of all stakeholders. Through open communication, designers can gather valuable feedback from users and other team members, which can help identify potential issues before they become major problems. By prioritizing communication throughout the design process, designers can minimize the number of iterations needed, reduce costs, and deliver high-quality products that meet the needs of all stakeholders.</p>

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<p>The post <a rel="nofollow" href="https://www.teqdiligent.com/8-mindset-traps-overcoming-them-as-a-technology-leaders-save-you-from-costly-design-iterations/">8 Mindset Traps: Overcoming them as a Technology Leaders save you from costly design iterations</a> appeared first on <a rel="nofollow" href="https://www.teqdiligent.com">Teq Diligent</a>.</p>
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		<title>How to estimate battery capacity?</title>
		<link>https://www.teqdiligent.com/how-to-estimate-battery-capacity/?utm_source=rss&#038;utm_medium=rss&#038;utm_campaign=how-to-estimate-battery-capacity</link>
		
		<dc:creator><![CDATA[Siddharth]]></dc:creator>
		<pubDate>Wed, 27 Jun 2018 17:45:32 +0000</pubDate>
				<category><![CDATA[Technical]]></category>
		<guid isPermaLink="false">https://www.teqdiligent.com/wp/?p=6310</guid>

					<description><![CDATA[<p>More and more hardware designs are powered from battery with the rise of portable devices, hand held devices, IoT devices and wearable devices. As the battery selection directly affects back-up time and form factor of these devices, it is very important to find out right battery for these devices in the beginning of design process. This article illustrates the procedure on how to estimate required battery power. It is a simple three step proces</p>
<p>The post <a rel="nofollow" href="https://www.teqdiligent.com/how-to-estimate-battery-capacity/">How to estimate battery capacity?</a> appeared first on <a rel="nofollow" href="https://www.teqdiligent.com">Teq Diligent</a>.</p>
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			<p>More and more hardware designs are powered from battery with the rise of portable devices, hand held devices, IoT devices and wearable devices. As the battery selection directly affects back-up time and form factor of these devices, it is very important to find out right battery for these devices in the beginning of design process. This article illustrates the procedure on how to estimate required battery power. It is a simple three step process.</p>
<p>&nbsp;</p>
<p><strong>Information required to begin with estimating battery capacity</strong></p>
<ul>
<li>Device Use cases</li>
<li>Device architecture</li>
<li>List of Major components</li>
<li>Information about power consumption of these major components</li>
<li>Back-up time required for device or intended battery to be used in battery capacity estimation</li>
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<p><strong>Step-1: Prepare a State Diagram</strong></p>
<p>First of all prepare a state diagram of different states of the devices depending on the use cases. These states provide information about components in active state and components in standby or power save mode. Clear understanding of user cases and architecture are required to chart out state diagram.</p>
<p><strong><br />
Step-2: Estimating average power for each state</strong></p>
<p>Further divide each state into different sub-states or events. Find out power required, occurrences &amp; duration of each of the events. Duration &amp; occurrences of event provide information about the duty cycle of that event. Consider 1 hour as the repetitive cycle for calculating duty cycle. Multiplying active power required for each of the event with its duty cycle provides information about the average active power of that event. Multiplying standby or power save mode power with (1 – duty cycle) provides information about the average standby power. Adding all these active and standby power of all the events of a state provides average power for that state.</p>
<p>&nbsp;</p>
<p><strong>Step-3: Estimating battery capacity or battery back-up time</strong></p>
<p>Adding average power of each of the states provides information about the average power requirements of the hardware.</p>
<p>Using appropriate battery voltage (battery voltage depends on battery chemistry), find out average current required from battery. Consideration of power efficiencies of power regulators need to be consider while deriving average current.</p>
<p>Total Average Current (mA) = Average power (mW) / [Battery voltage (Volt) x Efficiency]</p>
<p>Multiplying these total average current (mA) with required back-up time (hours) provides information about required mAH.</p>
<p>Battery capacity (mAH) = [Total average current (mA) * Back-up time (hours)] / [Battery Degradation Factor].</p>
<p>&nbsp;</p>
<p>For better battery life, batteries should not be discharged completely. It should be left with 20% of capacity while discharging. And discharge rate should be lesser than 50% capacity of battery for some of the battery chemistry types (e.g. lead acid battery). In this case, battery degradation factor is 0.4.</p>
<p>&nbsp;</p>
<p>In general, for other types of lithium batteries, Battery degradation factor can be approximated as 0.7. This factor is different in different literatures &amp; different battery chemistry types. More accurate estimates can be derived by considering Degradation factor based on the manufacturer’s recommendations of selected battery for better battery life.</p>
<p>Similarly if battery is decided and need to find out back-up time following equation can be used:</p>
<p>Back-up time (hours) = [Battery capacity (mAH) * Battery Degradation Factor] / [Required mAH]</p>
<p>Apart from estimating right battery capacity, it is also important to optimize the whole hardware design for better power efficiency. This will also help in increasing the backup time or reducing the size of battery and intern help in reducing the form factor of the device.</p>

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		<title>Is my design a high speed digital board design?</title>
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		<dc:creator><![CDATA[Siddharth]]></dc:creator>
		<pubDate>Fri, 25 May 2018 06:25:15 +0000</pubDate>
				<category><![CDATA[Technical]]></category>
		<guid isPermaLink="false">https://www.teqdiligent.com/wp/?p=6041</guid>

					<description><![CDATA[<p>The post <a rel="nofollow" href="https://www.teqdiligent.com/is-my-design-a-high-speed-digital-board-design/">Is my design a high speed digital board design?</a> appeared first on <a rel="nofollow" href="https://www.teqdiligent.com">Teq Diligent</a>.</p>
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			<p style="text-align: justify; font-family: verdana;">With increasing demands for higher data rates and bandwidths of the signals over wired and wireless communications, more and more digital boards are now falling in to the category of “HIGH SPEED DIGITAL BOARDS”. There are critical issues associated with high speed digital boards if those boards are not handled appropriately during design and development phases of the product development. This can lead to iterations in the product design cycle and affect the bottom lines of the product development projects. Therefore the first step in order to avoid this situations is to answer following question:</p>
<p><strong>“Is my design High Speed Digital board design?”</strong></p>
<p>&nbsp;</p>
<p style="text-align: justify; font-family: verdana;">Here is how you can get an idea about your category of digital board design: Low speed digital board design or high speed digital board design, during your board design activity. Following three parameters of the design will define the category of digital signal speed: Propagation delay of a medium, Rise time of a signal and trace length of a signal on board.</p>
<p>&nbsp;</p>
<p style="text-align: justify; font-family: verdana;">Let’s understand these three parameters first and then we will try to understand the correlation to find out the speed of the signal.</p>
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<h3><strong>Propagation Delay</strong>:</h3>
<p>&nbsp;</p>
<p style="text-align: justify; font-family: verdana;">Propagation delay is the time taken by digital signal to reach to point-B from point-A in a particular transmission medium. The propagation delay can be described in the “sec/inch” units. E.g. digital signals travelling on a FR4 PCB, in internal layers, shall experience a propagation delay of 180 psec/inch considering 4.5 as the dielectric constant of FR4. Propagation delay value changes based on the type of medium and its dielectric constants. You may find out information about propagation delay of common materials / mediums from internet. You may also get this information from material manufacturer.</p>
<p>&nbsp;</p>
<h3><strong>Rise Time:</strong></h3>
<p>&nbsp;</p>
<p style="text-align: justify; font-family: verdana;">The time required by a digital signal to reach to 90% of its high voltage level value from 10% of its high voltage level value when signal is transitioning from low voltage level to high voltage level. The rise time is generally expressed in terms of “milli-second”/ “micro-second” / “nano-second” etc. The rise time of the signals generally depends on the characteristics of the transmitter and the capacitive elements along the transmission path. Rise time details are generally specified in the chipset datasheets.</p>
<p>&nbsp;</p>
<h3><strong>Trace length of a signal:</strong></h3>
<p>&nbsp;</p>
<p style="text-align: justify; font-family: verdana;">Trace length of a signal is the actual physical trace length from transmitter of the signal to receiver of the signal on the board. Trace length can be described in terms of inches or mills. If you have not started with layout phase, you can approximate the trace length distance by analyzing your top level placement strategy.</p>
<p>&nbsp;</p>
<h3><strong>Correlation &amp; speed of signal:</strong></h3>
<p>&nbsp;</p>
<p style="text-align: justify; font-family: verdana;">Based on various experimentations and from available literatures, following equation is derived. It can be used for categorizing the type of board.</p>
<p>6 x Trace length &gt; (Rise time of a signal) / (Propagation delay)</p>
<p>If above mentioned condition is true, we can approximate that the digital signal is a high speed digital signal and all precautions for component selection, schematic and routing should be taken care to handle on the board.</p>
<p>&nbsp;</p>
<p style="text-align: justify; font-family: verdana;">For example,<br />
The digital signal of 50MHz has a rise time of 2 ns and runs on a FR4 PCB in internal layer. The trace length of this signal is 2 inch on PCB. So,</p>
<p>B = Rise time / Propagation delay = (2 ns) / (180 ps / inch) = 11.11 inch</p>
<p>And</p>
<p>A = 6 x Trace length = 6 x 2 = 12 inch</p>
<p>Here, A &gt; B. Therefore this signal can act as a High speed digital signal on the board and all the necessary precautions are required to be taken care during design phase.</p>

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